Kaisi 18 in 1 Silicone Middle Layer Tin Planting BGA Reballing Platform for iPhone X-14 Pro Max
Kaisi 18 in 1 Silicone Middle Layer Tin Planting BGA Reballing Platform for iPhone X-14 Pro Max
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Shipping Guranteee
Shipping Guranteee
FREE SHIPPING on all orders. Fully Insured.
Handling time: 1 - 3 working days. (Onkiza has to process your order and put all your items through its strict quality-control tests.)
Transit time: 3 - 15 working days.
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.
DOA Guarantee
DOA Guarantee
If your item arrives damaged, please contact us within 7 days and provide clear and valid proof. Onkiza will make compensation based on the damage situation.
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. Onkiza will make compensation based on the damage situation.
2. Super magnetic force / multi-model infinite extension base / precise positioning and close fit
3. Precise positioning / fast tin planting / strong magnetic adsorption
4. Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism
5. Steel material, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
6. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
7. With precise positioning, it is more convenient to align the whole position
8. Silicone material is used to effectively isolate temperature and prevent scalding
9. The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing
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